【Tech Taipei】週四直播!詳解能源轉型及再生能源發展時代的趨勢與挑戰!
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2G/3G服務中止 M2M通訊服務面臨中斷風險
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適用邊緣IoT裝置的能量採集技術比較
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新標準讓嵌入式快閃記憶體元件更容易替換
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手機廠積極佈局 AR技術核心元件解析
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ADC
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腦機介面無回應?
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CMOS製程
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迎接「奈米片」電晶體新時代
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CDI
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讓電網智慧化
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感測器/MEMS技術
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下一代穿戴式裝置實現更全面的遠端監測
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3D感測
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2022年蘋果AirPods系列產品出貨將達8,500萬套
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sanity check
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工程計算機的小數點大學問
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5G
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2022年科技產業趨勢預測
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Arm Corstone
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結合軟硬體 全面解決方案消弭IoT開發痛點
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IT
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過去一年八成以上台灣中小企業曾遭網路威脅
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iPhone 13
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2022年NAND Flash市場進入跌價週期
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5G
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數位浪潮引領連網趨勢 網路安全迫在眉睫
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Bayonet Neill-Concelman
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評測類比開關
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MSI
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全球矽晶圓出貨成長力道延續至2024年
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CSP
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2021年台伺服器ODM生產比重將逼近全球9成
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2030數位羅盤
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從供應鏈分析 全球半導體產業新趨勢成形?
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AIoT
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運用AIoT實現多元智慧城鄉應用 亞矽助推台灣新創展現活力
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2021台灣創新技術博覽會
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前瞻技術齊聚一堂 未來科技館點亮新視野
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5G
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功率暨化合物半導體晶圓廠產能2023年登頂
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NASA
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揭開「太空裝」內部的奧秘
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3D GPU
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分析晶片設計從業者困境
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ASP
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2022年DRAM產業將進入跌價週期
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EE人生
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讓我們繼續攜手改變世界!
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再生能源
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實現商業化核融合發電沒有想像中那麼遙遠!
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中國洪水
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2021年末值得關注的物流和海運挑戰
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5G
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半導體晶片缺貨已成全球產業新常態
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BOM
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拆解微軟Xbox 360 S:尺寸變小、發熱更少
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LED
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木地板變身奈米發電機 走路就能發電
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ADAS
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難道「設計太好」也是一種錯?
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BLE
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塑造穿戴式裝置產業的四大趨勢
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晶圓代工
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2020年全球晶圓代工成長率預估下修至個位數
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ODM
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2021年全球伺服器出貨成長將逾5%
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新冠病毒
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Covid-19成為熱像儀/熱偵測器市場成長主動力
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感測器/MEMS技術
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MEMS技術投入COVID-19戰疫
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晶圓代工
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不受疫情影響 晶圓雙雄Q1業績皆現成長
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台灣科技新創
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串聯政府、民間與國際 讓全球看見台灣抗疫經驗
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供應鏈
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不只台積電 全供應鏈小心庫存水位!
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ICS
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你的智慧城市夠安全嗎?
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新創
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亞洲·矽谷聯手GO SMART展現台灣防疫科技實力
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X光檢測
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利用「可解釋AI」強化X光檢測Covid-19結果
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PC
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台灣平板與手機市場受疫情衝擊最大
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儲存技術
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安全認證為後疫情時代把關IoT裝置安全
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2021 Tech Taipei – 工業4.0與智慧製造研討會【上】
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2021 Tech Taipei – 工業4.0與智慧製造研討會【下】
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狀態監測(CbM)開發平台,從振動感測到演算法開發
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2021 藍牙中國研討會 – 無線未來,無限想像
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製造業無痛數位轉型教戰守則
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可能讓您付出代價的十件事 – PCB 設計協作的挑戰
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如何在氮化鎵GaN操作狀態下執行動態測試分析?
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【2021年10月雜誌 】 腦機介面無回應?
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如何實現實用且有效的數字預失真解決方案
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【精彩重播】5G・AI・IoT—打造智慧城研討會
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免費申請 2021 電動車未來趨勢研...
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免費申請 2021 車聯網技術應用研討會暨論壇講義
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免費申請 AOS 1.2KV SiC MOSFET Samples Box 開發板
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免費申請SMART DDR4 NVDIMM (含 backup power + cable)
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免費申請SMART DDR5 32GB RDIMM
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2G/3G服務中止 M2M通訊服務面臨中斷風險
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下一代穿戴式裝置實現更全面的遠端監測
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2022年蘋果AirPods系列產品出貨將達8,500萬套
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英飛凌模組和晶片技術為陽光電源提供動力
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適用邊緣IoT裝置的能量採集技術比較
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恩智浦擴展安全UWB產品組合支援新興IoT應用
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新標準讓嵌入式快閃記憶體元件更容易替換
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用AI幫你的廣告文案找靈感!
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從雲端走入凡間:「AI at the Edge」商機發酵中
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施耐德攜手宏于電機打造東亞首座關鍵電力服務中心
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又是不怎麼智慧的智慧家庭設定…
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AiP技術為毫米波雷達帶來的演進與創新
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振興美國晶片製造業就對了?學者提異見
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分析師:邊緣AI將在2025年超越雲端
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H1-B簽證凍結 美科技業憂人才流失
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慶祝安富利成立一百周年,傳承世紀成就
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Hydra3D飛行時間CMOS影像傅感器
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Littelfuse
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Littelfuse推出集成限流和熱關斷功能的1安培故障保護固態繼電器
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ADAQ4003:18位元、2 MSPS μModule®資料取得解決方案
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ADFS5758:通過IEC-61508認證的功能安全16位元DAC
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eSIM Cookbook:相關秘技協助您順利擁抱下一代聯網裝置
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使用示波器量測電源供應器的控制迴路響應
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電源軌量測入門
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CoolSiC MOSFET
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英飛凌模組和晶片技術為陽光電源提供動力
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IEC
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TRUE MEMS揚聲器現已投產
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iPhone
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Ansys和蘋果開發雲端射頻安全測試模擬方案
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5G企業專網
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5G數據上傳速度即將大躍進
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3D IC
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完整3D-IC平台可應用於多小晶片設計
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3D霍爾效應位置感測器
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3D霍爾效應位置感測器實現更快的即時控制
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5G
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加速現今智慧世界技術數位化轉型
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HCI
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最新版超融合平台協助ISV打造一站式方案
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5G
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利凌推出「Aida邊緣運算P7及Z7 AI攝影機」
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VR
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驊訊電子攜手開酷科技發表智慧耳機
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FET
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德州儀器攜手台達打造伺服器電源供應器
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5G
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半導體參數測試系統納入KTE V7.1軟體
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ICS
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立德國際助益網科技取得IEC-62443-4-1認證
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LoRa系
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全新LoRa系統單晶片方案讓農場更智慧
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GaN
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中央大學攜手是德建立第三代半導體研發暨測試開放實驗室
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5G
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新工業級固態硬碟瞄準5G/AIoT應用
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Cortex-M
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英飛凌標準安全MCU系列通過PSA 2級認證
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Game Design
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公益型黑客松激發創意
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Edge Computing
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慧榮科技搶先布局AI應用
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12吋薄晶圓
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英飛凌高科技晶片廠正式啟用營運
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AI晶片
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結合軟/硬體與服務 矽谷IC新創搶攻AI普及化商機
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GPU
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重新起飛:Imagination執行長的冒險旅程
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ADAS
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確保複雜系統運作可靠度 晶片內的「小眼睛」幫大忙
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5G
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台灣何妨勇敢航向運動科技藍海?
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EE人生
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疫情下的遠距工作者「五誡」
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EDA/IP技術
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EE人群像:他是優秀電子工程師也是好手藝木匠!
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3D IC
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下一代先進IC設計人才需要懂封裝!
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EE人生
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新冠疫情加速工程師選擇退休?
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EE人生
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「學姊」牽線 Arrow與台大攜手促創新、育人才
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EE人生
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AI為大學工程教育帶來什麼衝擊?
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EDA/IP技術
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他是從不走調的EDA產業資深樂手…
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EE人生
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培養科技人才不能只注重數理!
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內容
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「看電視」的選擇困難症…
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2nm
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2nm晶圓廠真可滿足歐盟的晶片野心嗎?
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ADAS
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ADAS可能帶來意想不到的後果?
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DMS
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無益交通安全 自動駕駛技術分級根本沒啥用?
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GPU
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人工智慧時代的雙面刃
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e-waste
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更好的電解電容能減少電子垃圾嗎?
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倉儲產業
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勞動力短缺是供應鏈下一個主要問題
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供應鏈
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晶片缺貨之後就換過剩? 分析師有「異見」
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RF
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類比IC晶圓廠正在復興嗎?
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